On June 27th, 2023 at 2.00 pm Piero Triverio, Professor at University of Toronto, will hold a seminar on "Emerging challenges and developments in the electromagnetic modeling of 3D integrated circuits and metasurface antennas" in DEIB Seminar Room (Building 20).

Industrial needs in terms of computational electromagnetism are rapidly soaring beyond the state of the art, driven by new integrated circuit technologies (3D integration, chiplets, sub-nm scaling), antenna architectures (metasurfaces) and progress in quantum computing hardware. To meet these emerging needs, numerical methods for computational electromagnetism must be advanced substantially in terms of performance, scalability, multiscale capabilities, frequency range, and compatibility with quantum mechanical models. After reviewing these challenges, we will present some recent findings from our group in the area of integral equation methods for Maxwell's equations, including: fast algorithms for multiscale problems, large-scale parallelization, and potential-based formulations with unprecedented frequency range of validity and compatibility with quantum mechanics.

Piero Triverio received the Ph.D. degree in Electronic Engineering from Politecnico di Torino, Italy, in 2009. He is a Professor in the Department of Electrical & Computer Engineering at the University of Toronto, with cross-appointments to the Institute of Biomedical Engineering and to the Department of Mechanical and Industrial Engineering. He holds the Canada Research Chair in Computational Electromagnetics. His research interests include signal integrity, computational electromagnetism, and computational fluid dynamics applied to cardiovascular diseases. Prof. Triverio and his students received the Piergiorgio Uslenghi Letters Prize Paper Award (2021), the Best Paper Award of the IEEE Transactions on Advanced Packaging (2007), the EuMIC Young Engineer Prize (2010), and the Ontario Early Researcher Award (2016). Triverio and his students won several awards at international conferences, including the Best Paper Award of the IEEE Conference on Electrical Performance of Electronic Packaging and Systems (2008, 2017).